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ADT7470ARQZ
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Analog Devices Inc. |
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16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) 400kHz Thermal Management 5.5V V 5mm mm Contains Lead |
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ADM1023ARQ-REEL7
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Rochester Electronics, LLC |
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16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mm |
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LTC2986CLX-1#PBF
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Linear Technology/Analog Devices |
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48-LQFP |
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48-LQFP Thermal Management |
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W83792G
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Nuvoton Technology Corporation of America |
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48-LQFP |
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48-LQFP Thermal Management |
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ADM1023ARQZ
|
ON Semiconductor |
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16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V 4.9022mm mm Lead Free |
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ADT7516ARQZ
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Analog Devices Inc. |
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16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management 5mm mm Contains Lead |
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MCP9805T-BE/ST
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Microchip Technology |
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8-TSSOP (0.173, 4.40mm Width) |
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8-TSSOP (0.173, 4.40mm Width) Thermal Management 3, 3.6 V V Contains Lead |
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EMC2101-R-ACZL-TR
|
Microchip Technology |
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8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
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8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management 3, 3.6 V V 3.2mm mm |
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ADM1021AARQZ-R7
|
ON Semiconductor |
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16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V 4.9022mm mm Lead Free |
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LM63DIMA/NOPB
|
Texas Instruments |
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8-SOIC (0.154, 3.90mm Width) |
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8-SOIC (0.154, 3.90mm Width) Thermal Management 3.3V V 4.9mm mm Lead Free |
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LM64CILQ-F/NOPB
|
Texas Instruments |
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24-WFQFN Exposed Pad |
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24-WFQFN Exposed Pad Thermal Management 3.3V V 5mm mm Lead Free |
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LDS9003-002-T2
|
IXYS Integrated Circuits Division |
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16-WFQFN Exposed Pad |
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16-WFQFN Exposed Pad Thermal Management 3mm mm |
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ADT7517ARQZ-REEL7
|
Rochester Electronics, LLC |
|
16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management |
|
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EMC2104-BP-TR
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Microchip Technology |
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20-VFQFN Exposed Pad |
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20-VFQFN Exposed Pad Thermal Management 3.3V V 4mm mm Lead Free |
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MCP98242T-BE/MCBAA
|
Microchip Technology |
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8-VFDFN Exposed Pad |
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8-VFDFN Exposed Pad Thermal Management |
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NCT7511Y TR
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Nuvoton Technology Corporation of America |
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16-WQFN Exposed Pad |
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16-WQFN Exposed Pad Thermal Management |
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MCP98242T-BE/MCBA2
|
Microchip Technology |
|
8-VFDFN Exposed Pad |
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8-VFDFN Exposed Pad Thermal Management |
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LTC2995CUD#PBF
|
Linear Technology/Analog Devices |
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20-WFQFN Exposed Pad |
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20-WFQFN Exposed Pad Thermal Management |
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SE97TP/S900,547
|
NXP USA Inc. |
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8-WFDFN Exposed Pad |
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8-WFDFN Exposed Pad Thermal Management |
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LTC2986CLX#PBF
|
Linear Technology/Analog Devices |
|
48-LQFP |
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48-LQFP Thermal Management |
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MCP98243T-BE/MCAA
|
Microchip Technology |
|
8-VFDFN Exposed Pad |
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8-VFDFN Exposed Pad Thermal Management 3.5, 36 V V |
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NCT7491MNTXG
|
ON Semiconductor |
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24-VFQFN Exposed Pad |
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24-VFQFN Exposed Pad Thermal Management 3.6V V 4mm mm Lead Free |
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TSE2002GB2A1NRG
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Integrated Device Technology (IDT) |
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DFN |
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DFN Thermal Management 2mm mm Lead Free |
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ADT7467ARQZ-REEL7
|
ON Semiconductor |
|
16-SSOP (0.154, 3.90mm Width) |
|
16-SSOP (0.154, 3.90mm Width) Thermal Management |
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ADM1030ARQZ
|
Rochester Electronics, LLC |
|
16-SSOP (0.154, 3.90mm Width) |
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16-SSOP (0.154, 3.90mm Width) Thermal Management |
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